Pixel Concept for CDFII
A pixel detector at the innermost radius for precision vertexing at high luminosity
This page is under construction and some links may be password protected. This page is intended for internal communication between those interested in exploring a pixel option for CDFII in Run IIb. Much of this information is potentially useful for D0 consideration of an inner pixel system as well.

May 2001: CDF will pursue an all microstrip solution (no pixels) for its replacement tracker. Pixels remain a possible technology for both CDF and D0 in RunIIb if new information about the RunIIb environment indicates that pixels are needed. These pages will no longer be updated on a regular basis.
Overview
We consider the advantages and feasibility of replacing an irradiated Layer00 silicon strip detector by a pixel system for Run IIb running and beyond. The possible advantages include increased radiation survivability up to 30 fb-1 or more, improved impact parameter resolution, large S/N with very high efficiency, and improved pattern recognition for associating hits to tracks. The feasibility of installing this system relies on the advanced R&D of similar systems. In particular, the FPIX series of readout chips bump bonded to ATLAS style sensors has already achieved excellent performance in beam tests. The DAQ for the pixel system is expected to have many similarities to a system under development for the proposed BTeV experiment. We recognize that this system is conceptually new for CDFII and we recommend that a Layer00 strip replacement also be pursued simultaneously until clear advantages of a pixel system and minimal risk for project completion can be demonstrated.
Key Points
Radiation survivability
 Pixels increase that probability that only one replacement need to be performed
Feasibility
 Estimate is that both production sensors and chips could be ordered by the end of 2001
FNAL expertise
 Rad hard vertex, ASIC design, and ESE groups have worked for several years on pixels
CDF expertise
 Strong involvement in both ATLAS and CMS pixels as well as diamond R&D
Tracking performance
 Excellent position resolution and pattern recognition capabilities
Physics performance
 To be quantified is the impact on b-tagging needed for Higgs search
Cost
 Benefits from the overlap with the current BTeV R&D efforts

Specifications at a glance
Geometry option 1 - staggered option Geometry option 2 - tilted option
Specifications for option 1

Sub topics
Radiation resistance Tracking performance
FPIX readout chip DAQ components
Sensors Power supplies
Modules and bump bonding Mechanical including material budget
Low mass HDI cable Cooling
Pixel port card Physics capabilities
Meetings
First CDFII Replacement Silicon Workshop Mar 15, 2000: agenda, pixel talk (pdf)
Second CDFII Replacement Silicon Workshop June 14, 2000: agenda, pixel talks
Third CDFII Replacement Silicon Workshop July 11, 2000: agenda, pixel talks
Fourth CDFII Replacement Silicon Workshop Aug 8, 2000: agenda, pixel talks
Special Pixel subgroup meeting Sept 20, 2000: agenda, pixel talks
Pixel subgroup meeting Dec 13, 2000: agenda (pdf)
Pixel subgroup meeting Jan 25 2001: agenda (pdf)
Pixel subgroup meeting Feb 22 2001: agenda, pixel talks
Pixel subgroup meeting Mar 22 2001: agenda, pixel talks
Main Proposal Document
Update of the above document for the CDF collaboration and PAC: pdf, ps
Current version of the draft (in progress): history, pdf, ps, LaTeX and figures
CDF Review committee questions and answers
Presentation to the CDF Review Committee Oct 19, 2000 (pdf)
Presentation to the CDF Review Committee Apr 4, 2001 (pdf)
Other talks
Presentation to D0 RunIIb group April 14, 2000: pixel talk (pdf)
Presentation to the BTeV pixel subgroup Oct 16, 2000: pixel talk (pdf)
Presentation to D0 RunIIb pixel group Feb 7, 2001: pixel talk (pdf)
Links
UC Davis CDF pixel page
CDF RunIIb web page
D0 pixel page
FNAL radiation hard vertex group
ATLAS pixel system overview
CMS pixel system overview


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Last updated May 5, 2001 by William Wester